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? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c1075_x7r_ht_smd ? 3/30/2015 1 overview kemets high temperature x7r dielectric capacitors are formulated and designed for extreme temperature applications. constructed of a robust and proprietary base metal electrode (bme) dielectric system, these devices are capable of reliable operation in temperatures up to 175c. providing an attractive combination of performance and robustness in general high temperature applications, high temperature x7r dielectric capacitors are well suited for high temperature bypass and decoupling applications or frequency discriminating circuits where q and stability of capacitance characteristics are not critical. they exhibit a predictable change in capacitance with respect to time, voltage and temperature up to 175c. surface mount multilayer ceramic chip capacitors (smd mlccs) high temperature 175oc, x7r dielectric, 16 C 200 vdc (industrial grade) ordering information c 1210 r 225 k 3 r a c t050 ceramic case size 1 (l" x w") specifcation/ series 1 capacitance code (pf) capacitance tolerance rated voltage (vdc) dielectric failure rate/ design termination finish packaging/grade (c-spec) 2 0402 0603 0805 1206 1210 1812 g = 175c with standard termination r = 175c w/ flexible termination first two digits represent signifcant fgures. third digit specifes number of zeros. j = 5% k = 10% m = 20% 4 = 16 3 = 25 5 = 50 2 = 200 r = x7r a = n/a c = 100% matte sn blank = bulk 7292 = waffe pack/tray tu = 7" reel - unmarked (full reel quantity) t050 = 50 pieces/7" reel - unmarked t100 = 100 pieces/7" reel - unmarked t250 = 250 pieces/7" reel - unmarked t500 = 500 pieces/7" reel - unmarked t1k0 = 1,000 pieces/reel - unmarked 1 flexible termination option is only available in 0603 (1608 metric) and larger case sizes. 2 reeling quantities are dependent upon chip size and thickness dimension. when ordering using the "t1k0" packaging option, 1812 case size devices with chip thickness of 1.9 mm (nominal) may be shipped on multiple 7" reels or a single 13" reel. the term "unmarked" pertains to laser marking of components. all packaging options labeled as "unmarked" will contain capacitors that have not been laser marked. additional reeling or packaging options may be available. contact kemet for details. one world. one kemet
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c1075_x7r_ht_smd ? 3/30/2015 2 dimensions C millimeters (inches) C standard termination l b w s t eia size code metric size code l length w width t thickness b bandwidth s separation minimum mounting technique 0402 1005 1.00 (0.040) 0.05 (0.002) 0.50 (0.020) 0.05 (0.002) see table 2 for thickness 0.30 (0.012) 0.10 (0.004) 0.30 (0.012) solder refow only 0603 1608 1.60 (0.063) 0.15 (0.006) 0.80 (0.032) 0.15 (0.006) 0.35 (0.014) 0.15 (0.006) 0.70 (0.028) solder wave or solder refow 0805 2012 2.00 (0.079) 0.20 (0.008) 1.25 (0.049) 0.20 (0.008) 0.50 (0.02) 0.25 (0.010) 0.75 (0.030) 1206 3216 3.20 (0.126) 0.20 (0.008) 1.60 (0.063) 0.20 (0.008) 0.50 (0.02) 0.25 (0.010) n/a 1210 3225 3.20 (0.126) 0.20 (0.008) 2.50 (0.098) 0.20 (0.008) 0.50 (0.02) 0.25 (0.010) solder refow only 1812 4532 4.50 (0.177) 0.30 (0.012) 3.20 (0.126) 0.30 (0.012) 0.60 (0.024) 0.35 (0.014) solder refow only dimensions C millimeters (inches) C flexible termination eia size code metric size code l length w width t thickness b bandwidth s separation minimum mounting technique 0603 1608 1.60 (0.064) 0.17 (0.007) 0.80 (0.032) 0.15 (0.006) see table 2 for thickness 0.45 (0.018) 0.15 (0.006) 0.58 (0.023) solder wave or solder refow 0805 2012 2.00 (0.079) 0.20 (0.008) 1.25 (0.049) 0.20 (0.008) 0.50 (0.02) 0.25 (0.010) 0.75 (0.030) 1206 3216 3.30 (0.130) 0.40 (0.016) 1.60 (0.063) 0.20 (0.008) 0.60 (0.024) 0.25 (0.010) n/a 1210 3225 3.30 (0.130) 0.40 (0.016) 2.50 (0.098) 0.20 (0.008) 0.60 (0.024) 0.25 (0.010) solder refow only 1812 4532 4.50 (0.178) 0.40 (0.016) 3.20 (0.126) 0.30 (0.012) 0.70 (0.028) 0.35 (0.014) solder refow only surface mount multilayer ceramic chip capacitors (smd mlccs) high temperature 175oc, x7r dielectric, 16 C 200 vdc (industrial grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c1075_x7r_ht_smd ? 3/30/2015 3 overview cont'd concerned with fex cracks resulting from excessive stresses produced during board fexure and thermal cycling? these devices are available with kemet's flexible termination technology which inhibits the transfer of board stress to the rigid ceramic body, therefore mitigating fex cracks which can result in low ir or short circuit failures. although fexible termination technology does not eliminate the potential for mechanical damage that may propagate during extreme environmental and handling conditions, it does provide superior fex performance over standard termination systems. kemets high temperature x7r surface mount mlccs are manufactured in state of the art iso/ts 16949:2009 certifed facilities and are proven to function reliably in harsh, high temperature and high humidity, down-hole environments. benefts ? operating temperature range of -55c to +175c ? voltage derating not required ? lead (pb)-free, rohs and reach compliant ? base metal electrode (bme) dielectric system ? eia 0402, 0603, 0805, 1206, 1210 and 1812 case sizes ? dc voltage ratings of 16 v, 25 v, 50 v & 200 v ? capacitance offerings ranging from 2.7 nf to 3.3 f ? available capacitance tolerances of 5%, 10% & 20% ? non-polar device, minimizing installation concerns ? 100% pure matte tin-plated termination fnish allowing for excellent solderability ? flexible termination option available upon request applications typical applications include decoupling, bypass, fltering and transient voltage suppression in extreme environments such as down-hole exploration, aerospace engine compartments and geophysical probes. application notes x7r dielectric is not recommended for ac line fltering or pulse applications. voltage derating of these capacitors is not required for application temperatures up to 175c. qualifcation/certifcation high temperature industrial grade products meet or exceed the requirements outlined table 4, performance & reliability. qualifcation packages are available upon request. surface mount multilayer ceramic chip capacitors (smd mlccs) high temperature 175oc, x7r dielectric, 16 C 200 vdc (industrial grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c1075_x7r_ht_smd ? 3/30/2015 4 environmental compliance lead (pb)-free, rohs, and reach compliant without exemptions. electrical parameters/characteristics item 3dudphwhuvkdudfwhulvwlfv operating temperature range -55c to +175c capacitance change with reference to +25c and 0 vdc applied (tcc) 15% (-55c to +125c) beyond 125c see "capacitance vs. temperature performance" plot - reference only aging rate (maximum % capacitance loss/decade hour) <3.0% dielectric withstanding voltage (dwv) 250% of rated voltage (5 1 seconds and charge/discharge not exceeding 50 ma) dissipation factor (df) maximum limit at 25oc see dissipation factor limit table insulation resistance (ir) limit at 25c 1,000 megohm microfarads or 100 g (rated voltage applied for 120 5 secs at 25c) 5hjduglqjdjlqjudwh&dsdflwdqfhphdvxuhphqwvlqfoxglqjwrohudqfhduhlqghhgwrduhihuhhwlphrikrxuv 7rrewdlq,5olplwglylgh0)ydoxhewkhfdsdflwdqfhdqgfrpsduhwr*olplw6hohfwwkhorzhuriwkhwzrolplwv &dsdflwdqfhdqgglvvlsdwlrqidfwru')phdvxuhgxqghuwkhiroorzlqjfrqglwlrqv n++dqg9upvlifdsdflwdqfh) 1rwh:khqphdvxulqjfdsdflwdqfhlwlvlpsruwdqwwrhqvxuhwkhvhwyrowdjhohyholvkhogfrqvwdqw7kh+3dqgjlohqw(kdyhdihdwxuhnqrzqdv xwrpdwlf/hyho&rqwuro/&7kh/&ihdwxuhvkrxogehvzlwfkhgwr21 dissipation factor limit table rated dc voltage dissipation factor 16/25 3.5% >25 2.5% post environmental limits high temperature life, biased humidity, moisture resistance dielectric rated dc voltage capacitance value dissipation factor (maximum %) capacitance shift insulation resistance x7r 16/25 all 5.0 20% 10% of initial limit >25 3.0 surface mount multilayer ceramic chip capacitors (smd mlccs) high temperature 175oc, x7r dielectric, 16 C 200 vdc (industrial grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c1075_x7r_ht_smd ? 3/30/2015 5 capacitance vs. bias voltage performance (1812 case size, 1.0 f, 50 vdc rated) capacitance vs. bias voltage performance (25 vdc rated ) capacitance vs. temperature performance (-55c to +175c) - 80.00 - 70.00 - 60.00 - 50.00 - 40.00 - 30.00 - 20.00 - 10.00 0.00 10.00 - 55 - 40 - 25 - 10 5 20 35 50 65 80 95 110 125 140 155 170 capacitance change % temperature ( c) capacitance vs. temperature performance ( - 55 c to +175 c) 0603 (1608), 0.1f, 25v 0805 (2012), 0.27f, 25v 1206 (3216), 1.0f, 25v 1210 (3225), 2.2f, 25v 1812 (4532), 3.3f, 25v 1812 (4532), 1.0f, 50v -80.0 -70.0 -60.0 -50.0 -40.0 -30.0 -20.0 -10.0 0.0 10.0 0 5 10 15 20 25 capacitance change % bias dc voltage capacitance vs. bias voltage performance (25vdc rated ) 0603 (1608), 0.1f, 25v 0805 (2012), 0.27f, 25v 1210 (3225), 2.2f, 25v 1812 (532), 3.3f, 25v -0.0 -35.0 -30.0 -25.0 -20.0 -15.0 -10.0 -5.0 0.0 5.0 10.0 0 5 10 15 20 25 capacitance change % bias dc voltage capacitance vs. bias voltage performance ( 1812 case size, 1.0f, 50vdc rated ) 1812 (532), 1.0f, 50v surface mount multilayer ceramic chip capacitors (smd mlccs) high temperature 175oc, x7r dielectric, 16 C 200 vdc (industrial grade) electrical characteristics
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c1075_x7r_ht_smd ? 3/30/2015 6 table 1 C capacitance range/selection waterfall (0402 C 1812 case sizes) capacitance cap code case size/ series c0402g c0603g/r c0805g/r c1206g/r c1210g/r c1812g/r voltage code 4 3 5 1 3 5 1 3 5 1 3 5 1 3 5 1 3 5 1 2 rated voltage (vdc) 16 25 50 100 25 50 100 25 50 100 25 50 100 25 50 100 25 50 100 200 capacitance tolerance product availability and chip thickness codes see table 2 for chip thickness dimensions 2700 pf 272 j k m bb bb bb 3300 pf 332 j k m bb bb bb 3900 pf 392 j k m bb bb bb 4700 pf 472 j k m bb bb bb 5600 pf 562 j k m bb bb bb 6800 pf 682 j k m bb bb bb 8200 pf 822 j k m bb bb bb 10000 pf 103 j k m bb bb bb 12000 pf 123 j k m bb bb 15000 pf 153 j k m bb bb 18000 pf 183 j k m bb bb cf cf 22000 pf 223 j k m bb bb cf cf 27000 pf 273 j k m cf cf 33000 pf 333 j k m cf cf 39000 pf 393 j k m cf cf 47000 pf 473 j k m bb cf cf dn dn 56000 pf 563 j k m cf cf dn dn gn gn gn gn 68000 pf 683 j k m cf cf dn dn 82000 pf 823 j k m cf cf dn dn 0.1 f 104 j k m cf cf dn dn ed ed gm gm gm gm 0.12 f 124 j k m cf dp dp ed ed 0.15 f 154 j k m cf dp dp ed ed 0.18 f 184 j k m df df ed ed fe fe 0.22 f 224 j k m dg dg ep ep fe fe gb gb 0.27 f 274 j k m dg dg ep ep ff ff gb gb 0.33 f 334 j k m dp ej ej ff ff gb gb 0.39 f 394 j k m dp ej ej fg fg gb gb 0.47 f 474 j k m dg ej ej fg fg gb gb 0.56 f 564 j k m dg ep fh fh gb gb 0.68 f 684 j k m dg ej fm fm gc gc 0.82 f 824 j k m ej fk fk ge ge 1 f 105 j k m ej fk fk gg gg 1.2 f 125 j k m fh gj gj 1.5 f 155 j k m fm gl gl 1.8 f 185 j k m fk ge 2.2 f 225 j k m fk gg 2.7 f 275 j k m gj 3.3 f 335 j k m gl capacitance cap code rated voltage (vdc) 16 25 50 100 25 50 100 25 50 100 25 50 100 25 50 100 25 50 100 200 voltage code 4 3 5 1 3 5 1 3 5 1 3 5 1 3 5 1 3 5 1 2 case size/ series c0402g c0603g/r c0805g/r c1206g/r c1210g/r c1812g/r surface mount multilayer ceramic chip capacitors (smd mlccs) high temperature 175oc, x7r dielectric, 16 C 200 vdc (industrial grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c1075_x7r_ht_smd ? 3/30/2015 7 table 2 C chip thickness/packaging quantities thickness code case size thickness range (mm) paper quantity plastic quantity 7" reel 13" reel 7" reel 13" reel bb 0402 0.50 0.05 10,000 50,000 0 0 cf 0603 0.80 0.07 4,000 15,000 0 0 dn 0805 0.78 0.10 4,000 15,000 0 0 dp 0805 0.90 0.10 4,000 15,000 0 0 df 0805 1.10 0.10 0 0 2,500 10,000 dg 0805 1.25 0.15 0 0 2,500 10,000 ed 1206 1.00 0.10 0 0 2,500 10,000 ep 1206 1.20 0.20 0 0 2,500 10,000 ej 1206 1.70 0.20 0 0 2,000 8,000 fe 1210 1.00 0.10 0 0 2,500 10,000 ff 1210 1.10 0.10 0 0 2,500 10,000 fg 1210 1.25 0.15 0 0 2,500 10,000 fh 1210 1.55 0.15 0 0 2,000 8,000 fm 1210 1.70 0.20 0 0 2,000 8,000 fk 1210 2.10 0.20 0 0 2,000 8,000 gb 1812 1.00 0.10 0 0 1,000 4,000 gc 1812 1.10 0.10 0 0 1,000 4,000 ge 1812 1.30 0.10 0 0 1,000 4,000 gg 1812 1.55 0.10 0 0 1,000 4,000 gj 1812 1.70 0.15 0 0 1,000 4,000 gn 1812 1.70 0.20 0 0 1,000 4,000 gl 1812 1.90 0.20 0 0 500 2,000 gm 1812 2.00 0.20 0 0 500 2,000 thickness code case size thickness range (mm) 7" reel 13" reel 7" reel 13" reel paper quantity plastic quantity package quantity based on fnished chip thickness specifcations. surface mount multilayer ceramic chip capacitors (smd mlccs) high temperature 175oc, x7r dielectric, 16 C 200 vdc (industrial grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c1075_x7r_ht_smd ? 3/30/2015 8 table 3a C land pattern design recommendations per ipcC7351 C standard termination eia size code metric size code density level a: maximum (most) land protrusion (mm) density level b: median (nominal) land protrusion (mm) density level c: minimum (least) land protrusion (mm) c y x v1 v2 c y x v1 v2 c y x v1 v2 0402 1005 0.50 0.72 0.72 2.20 1.20 0.45 0.62 0.62 1.90 1.00 0.40 0.52 0.52 1.60 0.80 0603 1608 0.90 1.15 1.10 4.00 2.10 0.80 0.95 1.00 3.10 1.50 0.60 0.75 0.90 2.40 1.20 0805 2012 1.00 1.35 1.55 4.40 2.60 0.90 1.15 1.45 3.50 2.00 0.75 0.95 1.35 2.80 1.70 1206 3216 1.60 1.35 1.90 5.60 2.90 1.50 1.15 1.80 4.70 2.30 1.40 0.95 1.70 4.00 2.00 1210 3225 1.60 1.35 2.80 5.65 3.80 1.50 1.15 2.70 4.70 3.20 1.40 0.95 2.60 4.00 2.90 1812 4532 2.15 1.60 3.60 6.90 4.60 2.05 1.40 3.50 6.00 4.00 1.95 1.20 3.40 5.30 3.70 density level a: for low-density product applications. recommended for wave solder applications and provides a wider process window for refow solder processes. kemet only recommends wave soldering of eia 0603, 0805 and 1206 case sizes. density level b: for products with a moderate level of component density. provides a robust solder attachment condition for refow solder processes. density level c: for high component density product applications. before adapting the minimum land pattern variations the user should perform qualifcation testing based on the conditions outlined in ipc standard 7351 (ipcC7351). image below based on density level b for an eia 1210 case size. y c c x x v1 v2 grid placement courtyard y surface mount multilayer ceramic chip capacitors (smd mlccs) high temperature 175oc, x7r dielectric, 16 C 200 vdc (industrial grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c1075_x7r_ht_smd ? 3/30/2015 9 table 3b C land pattern design recommendations per ipcC7351 C flexible termination eia size code metric size code density level a: maximum (most) land protrusion (mm) density level b: median (nominal) land protrusion (mm) density level c: minimum (least) land protrusion (mm) c y x v1 v2 c y x v1 v2 c y x v1 v2 0603 1608 0.85 1.25 1.10 4.00 2.10 0.75 1.05 1.00 3.10 1.50 0.65 0.85 0.90 2.40 1.20 0805 2012 1.00 1.35 1.55 4.40 2.60 0.90 1.15 1.45 3.50 2.00 0.75 0.95 1.35 2.80 1.70 1206 3216 1.60 1.65 1.90 5.90 2.90 1.50 1.45 1.80 5.00 2.30 1.40 1.25 1.70 4.30 2.00 1210 3225 1.60 1.65 2.80 5.90 3.80 1.50 1.45 2.70 5.00 3.20 1.40 1.25 2.60 4.30 2.90 1812 4532 2.10 1.80 3.60 7.0 0 4.60 2.00 1.60 3.50 6.10 4.00 1.90 1.40 3.40 5.40 3.70 density level a: for low-density product applications. recommended for wave solder applications and provides a wider process window for refow solder processes. kemet only recommends wave soldering of eia 0603, 0805 and 1206 case sizes. density level b: for products with a moderate level of component density. provides a robust solder attachment condition for refow solder processes. density level c: for high component density product applications. before adapting the minimum land pattern variations the user should perform qualifcation testing based on the conditions outlined in ipc standard 7351 (ipcC7351). image below based on density level b for an eia 1210 case size. y c c x x v1 v2 grid placement courtyard y surface mount multilayer ceramic chip capacitors (smd mlccs) high temperature 175oc, x7r dielectric, 16 C 200 vdc (industrial grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c1075_x7r_ht_smd ? 3/30/2015 10 soldering process recommended soldering technique: ? solder wave or solder refow for eia case sizes 0603, 0805 and 1206 ? all other eia case sizes are limited to solder refow only recommended refow soldering profle: kemets families of surface mount multilayer ceramic capacitors (smd mlccs) are compatible with wave (single or dual), convection, ir or vapor phase refow techniques. preheating of these components is recommended to avoid extreme thermal stress. kemet s recommended profle conditions for convection and ir refow refect the profle conditions of the ipc/j-std-020 standard for moisture sensitivity testing. these devices can safely withstand a maximum of three refow passes at these conditions. profle feature termination finish 100% matte sn preheat/soak note 1: all temperatures refer to the center of the package, measured on the wrerwkwer time temperature t smin 25 c to peak t l t s 25 t p t smax t l t p maximum ramp up rate = 3 c/sec maximum ramp down rate = 6 c/sec surface mount multilayer ceramic chip capacitors (smd mlccs) high temperature 175oc, x7r dielectric, 16 C 200 vdc (industrial grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c1075_x7r_ht_smd ? 3/30/2015 11 table 4 C performance & reliability: test methods and conditions stress reference test or inspection method terminal strength jisCcC6429 appendix 1, note: package size (l" x w") force duration 0402 5 n (0.51 kg) 60 seconds 0603 10 n (1.02 kg) 0805 18 n (1.83 kg) board flex jisCcC6429 appendix 2, note: standard termination system C 2.0 mm (minimum) for all except 3 mm for c0g. flexible termination system C 3.0 mm (minimum). solderability jCstdC002 magnifcation 50 x. conditions: a) method b, 4 hours at 155c, dry heat at 235c b) method b at 215c category 3 c) method d, category 3 at 260c temperature cycling kemet defned 50 cycles (-55c to +220c). measurement at 24 hours +/- 4 hours after test conclusion. biased humidity milCstdC202 method 103 load humidity: 1,000 hours 85c/85% rh and rated voltage. add 100 k ohm resistor. measurement at 24 hours +/- 2 hours after test conclusion. low volt humidity: 1,000 hours 85c/85% rh and 1.5 v. add 100 k ohm resistor. measurement at 24 hours +/- 2 hours after test conclusion. moisture resistance milCstdC202 method 106 t = 24 hours/cycle. steps 7a and 7b not required. unpowered. measurement at 24 hours +/- 2 hours after test conclusion. high temperature life milCstdC202 method 108 /eiaC198 1,000 hours at 175c with 2 x rated voltage applied. storage life kemet defned 200c, 0 vdc for 1,000 hours. vibration milCstdC202 method 204 5 g's for 20 minutes, 12 cycles each of 3 orientations. note: use 8" x 5" pcb 0.031" thick 7 secure points on one long side and 2 secure points at corners of opposite sides. parts mounted within 2" from any secure point. test from 10 C 2,000 hz mechanical shock milCstdC202 method 213 figure 1 of method 213, condition f. resistance to solvents milCstdC202 method 215 add aqueous wash chemical, okem clean or equivalent. storage and handling ceramic chip capacitors should be stored in normal working environments. while the chips themselves are quite robust in other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term storage. in addition, packaging materials will be degraded by high temperatureC reels may soften or warp and tape peel force may increase. kemet recommends that maximum storage temperature not exceed 40oc and maximum storage humidity not exceed 70% relative humidity. temperature fuctuations should be minimized to avoid condensation on the parts and atmospheres should be free of chlorine and sulfur bearing compounds. for optimized solderability chip stock should be used promptly, preferably within 1.5 years of receipt. surface mount multilayer ceramic chip capacitors (smd mlccs) high temperature 175oc, x7r dielectric, 16 C 200 vdc (industrial grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c1075_x7r_ht_smd ? 3/30/2015 12 construction C standard termination dielectric material (batio 3 ) detailed cross section barrier layer (ni) inner electrodes (ni) termination finish (100% matte sn) barrier layer (ni) end termination / external electrode (cu) termination finish (100% matte sn) inner electrodes (ni) dielectric material (batio 3 ) end termination / external electrode (cu) construction C flexible termination dielectric material (batio 3 ) detailed cross section barrier layer (ni) inner electrodes (ni) termination finish (100% matte sn) barrier layer (ni) termination finish (100% matte sn) inner electrodes (ni) dielectric material (batio 3 ) epoxy layer (ag) epoxy layer (ag) end termination / external electrode (cu) end termination / external electrode (cu) surface mount multilayer ceramic chip capacitors (smd mlccs) high temperature 175oc, x7r dielectric, 16 C 200 vdc (industrial grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c1075_x7r_ht_smd ? 3/30/2015 13 capacitor marking (optional): these surface mount multilayer ceramic capacitors are normally supplied unmarked. if required, they can be marked as an extra cost option. marking is available on most kemet devices but must be requested using the correct ordering code identif er(s). if this option is requested, two sides of the ceramic body will be laser marked with a k to identify kemet, followed by two characters (per eiaC198 - see table below) to identify the capacitance value. eia 0603 case size devices are limited to the k character only. laser marking option is not available on: ? c0g, ultra stable x8r and y5v dielectric devices ? eia 0402 case size devices ? eia 0603 case size devices with flexible termination option. ? kps commercial and automotive grade stacked devices. ? x7r dielectric products in capacitance values outlined below marking appears in legible contrast. illustrated below is an example of an mlcc with laser marking of ka8, which designates a kemet device with rated capacitance of 100 f. orientation of marking is vendor optional. eia case size metric size code capacitance 0603 1608 170 pf 0805 2012 150 pf 1206 3216 910 pf 1210 3225 2,000 pf 1808 4520 3,900 pf 1812 4532 6,700 pf 1825 4564 0.018 f 2220 5650 0.027 f 2225 5664 0.033 f kemet id 2-digit capacitance code surface mount multilayer ceramic chip capacitors (smd mlccs) high temperature 175oc, x7r dielectric, 16 C 200 vdc (industrial grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c1075_x7r_ht_smd ? 3/30/2015 14 capacitor marking (optional) contd capacitance (pf) for various alpha/numeral identif ers 9 0 1 2 3 4 5 6 7 8 capacitance (pf) a 0.1 1 0 10 100 1,000 10,000 100,000 1,000,000 10,000,000 100,000,000 b 0.11 1.1 11 110 1,100 11,000 110,000 1,100,000 11,000,000 110,000,000 c 0.12 1 2 12 120 1,200 12,000 120,000 1,200,000 12,000,000 120,000,000 d 0.13 1 3 13 130 1,300 13,000 130,000 1,300,000 13,000,000 130,000,000 e 0.15 1 5 15 150 1,500 15,000 150,000 1,500,000 15,000,000 150,000,000 f 0.16 1 6 16 160 1,600 16,000 160,000 1,600,000 16,000,000 160,000,000 g 0.18 1 8 18 180 1,800 18,000 180,000 1,800,000 18,000,000 180,000,000 h 0.2 2 0 20 200 2,000 20,000 200,000 2,000,000 20,000,000 200,000,000 j 0.22 2 2 22 220 2,200 22,000 220,000 2,200,000 22,000,000 220,000,000 k 0.24 2.4 24 240 2,400 24,000 240,000 2,400,000 24,000,000 240,000,000 l 0.27 2.7 27 270 2,700 27,000 270,000 2,700,000 27,000,000 270,000,000 m 0.3 3 0 30 300 3,000 30,000 300,000 3,000,000 30,000,000 300,000,000 n 0.33 3 3 33 330 3,300 33,000 330,000 3,300,000 33,000,000 330,000,000 p 0.36 3 6 36 360 3,600 36,000 360,000 3,600,000 36,000,000 360,000,000 q 0.39 3 9 39 390 3,900 39,000 390,000 3,900,000 39,000,000 390,000,000 r 0.43 4 3 43 430 4,300 43,000 430,000 4,300,000 43,000,000 430,000,000 s 0.47 4.7 47 470 4,700 47,000 470,000 4,700,000 47,000,000 470,000,000 t 0.51 5.1 51 510 5,100 51,000 510,000 5,100,000 51,000,000 510,000,000 u 0.56 5 6 56 560 5,600 56,000 560,000 5,600,000 56,000,000 560,000,000 v 0.62 6 2 62 620 6,200 62,000 620,000 6,200,000 62,000,000 620,000,000 w 0.68 6 8 68 680 6,800 68,000 680,000 6,800,000 68,000,000 680,000,000 x 0.75 7 5 75 750 7,50 0 75,000 750,000 7,500,000 75,000,000 750,000,000 y 0.82 8 2 82 820 8,200 82,000 820,000 8,200,000 82,000,000 820,000,000 z 0.91 9.1 91 910 9,100 91,000 910,000 9,100,000 91,000,000 910,000,000 a 0.25 2 5 25 250 2,500 25,000 250,000 2,500,000 25,000,000 250,000,000 b 0.35 3 5 35 350 3,500 35,000 350,000 3,500,000 35,000,000 350,000,000 d 0.4 4 0 40 400 4,000 40,000 400,000 4,000,000 40,000,000 400,000,000 e 0.45 4 5 45 450 4,500 45,000 450,000 4,500,000 45,000,000 450,000,000 f 0.5 5 0 50 500 5,000 50,000 500,000 5,000,000 50,000,000 500,000,000 m 0.6 6 0 60 600 6,000 60,000 600,000 6,000,000 60,000,000 600,000,000 n 0.7 7 0 70 700 7,000 70,000 700,000 7,000,000 70,000,000 700,000,000 t 0.8 8 0 80 800 8,000 80,000 800,000 8,000,000 80,000,000 800,000,000 y 0.9 9 0 90 900 9,000 90,000 900,000 9,000,000 90,000,000 900,000,000 surface mount multilayer ceramic chip capacitors (smd mlccs) high temperature 175oc, x7r dielectric, 16 C 200 vdc (industrial grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c1075_x7r_ht_smd ? 3/30/2015 15 tape & reel packaging information kemet offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with eia standard 481. this packaging system is compatible with all tape-fed automatic pick and place systems. see table 2 for details on reeling quantities for commercial chips. 8 mm, 12 mm or 16 mm carrier tape 178 mm (7.00") or 330 mm (13.00") anti-static reel embossed plastic* or punched paper carrier. embossment or punched cavity anti-static co v er t ape (.10 mm (.004") maximum thic kness) chip and kps or ientation in p oc k et (e xcept 1825 commercial, and 1825 and 2225 milita r y) *eia 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only. kemet ? bar code label sprocket holes table 5 C carrier tape conf guration, embossed plastic & punched paper (mm) eia case size tape size (w)* embossed plastic punched paper 7" reel 13" reel 7" reel 13" reel pitch (p 1 )* pitch (p 1 )* 01005 C 0402 8 2 2 0603 8 4 4 0805 8 4 4 4 4 1206 C 1210 8 4 4 4 4 1805 C 1808 12 4 4 1812 12 8 8 kps 1210 12 8 8 kps 1812 & 2220 16 12 12 array 0508 & 0612 8 4 4 5hihuwr)ljxuhviru:dqg3 1 carrier tape reference locations. wrerwrwr surface mount multilayer ceramic chip capacitors (smd mlccs) high temperature 175oc, x7r dielectric, 16 C 200 vdc (industrial grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c1075_x7r_ht_smd ? 3/30/2015 16 figure 1 C embossed (plastic) carrier tape dimensions p o t f w c en t er li n e s of cav i t y a o b o u s e r d i r e c t i o n o f u n r e elin g c ov er t ap e k o b 1 i s f or t ap e f e ed er r e f e r ence onl y, i ncl u di ng dr a ft con c en t r i c a bou t b o . t 2 ? d 1 ? d o b 1 s 1 t 1 e 1 e 2 p 1 p 2 e m b os s m e nt f or c a v i t y s i z e , s e e n o t e 1 t a b l e 4 [ 1 0 p i t c h e s c um u l at i v e t ol er a n c e o n t a p e 0. 2 m m ] table 6 ? embossed (plastic) carrier tape dimensions metric will govern constant dimensions millimeters (inches) tape size d 0 d 1 minimum note 1 e 1 p 0 p 2 r reference note 2 s 1 minimum note 3 t maximum t 1 maximum 8 mm 1.5 +0.10/-0.0 (0.059 +0.004/-0.0) 1.0 (0.039) 1.75 0.10 (0.069 0.004) 4.0 0.10 (0.157 0.004) 2.0 0.05 (0.079 0.002) 25.0 (0.984) 0.600 (0.024) 0.600 (0.024) 0.100 (0.004) 12 mm 1.5 (0.059) 30 (1.181) 16 mm variable dimensions millimeters (inches) tape size pitch b 1 maximum note 4 e 2 minimum f p 1 t 2 maximum w maximum a 0 ,b 0 & k 0 8 mm single (4 mm) 4.35 (0.171) 6.25 (0.246) 3.5 0.05 (0.138 0.002) 4.0 0.10 (0.157 0.004) 2.5 (0.098) 8.3 (0.327) note 5 12 mm single (4 mm) & double (8 mm) 8.2 (0.323) 10.25 (0.404) 5.5 0.05 (0.217 0.002) 8.0 0.10 (0.315 0.004) 4.6 (0.181) 12.3 (0.484) 16 mm triple (12 mm) 12.1 (0.476) 14.25 (0.561) 7.5 0.05 (0.138 0.002) 12.0 0.10 (0.157 0.004) 4.6 (0.181) 16.3 (0.642) 1. the embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. dimensions of embossment location and hole location shall be applied independent of each other. 2. the tape with or without components shall pass around r without damage (see figure 6). 3. if s 1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see eia standard 481 paragraph 4.3 section b). 4. b 1 dimension is a reference dimension for tape feeder clearance only. 5. the cavity def ned by a 0 , b 0 and k 0 shall surround the component with suff cient clearance that: (a) the component does not protrude above the top surface of the carrier tape. (b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. (c) rotation of the component is limited to 20 maximum for 8 and 12 mm tapes and 10 maximum for 16 mm tapes (see figure 3). (d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see figure 4). (e) for kps series product, a 0 and b 0 are measured on a plane 0.3 mm above the bottom of the pocket. (f) see addendum in eia standard 481 for standards relating to more precise taping requirements. surface mount multilayer ceramic chip capacitors (smd mlccs) high temperature 175oc, x7r dielectric, 16 C 200 vdc (industrial grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c1075_x7r_ht_smd ? 3/30/2015 17 figure 2 C punched (paper) carrier tape dimensions u s e r d i r e c t ion of u n r eelin g t o p c o v e r t ape t c e n t e r l ines o f c a v i t y p 1 ? d o p o p 2 e 1 f e 2 w g a 0 b 0 c a v i t y s i z e , s e e n ote 1, tabl e 7 b o t t o m c o v e r t a p e t 1 t 1 b o t t o m c o v e r t a p e [10 p it c hes c u mu l a t i v e t o le r a n c e o n t a p e 0 . 2 m m] table 7 ? punched (paper) carrier tape dimensions metric will govern constant dimensions millimeters (inches) tape size d 0 e 1 p 0 p 2 t 1 maximum g minimum r reference note 2 8 mm 1.5 +0.10 -0.0 (0.05 +0.00 -0.0) 1.75 0.10 (0.06 0.00) .0 0.10 (0.157 0.00) 2.0 0.05 (0.07 0.002) 0.10 (0.00) maximum 0.75 (0.030) 25 (0.8) variable dimensions millimeters (inches) tape size pitch e2 minimum f p 1 t maximum w maximum a 0 b 0 8 mm half (2 mm) 6.25 (0.26) 3.5 0.05 (0.138 0.002) 2.0 0.05 (0.07 0.002) 1.1 (0.08) 8.3 (0.327) note 1 8 mm single ( mm) .0 0.10 (0.157 0.00) 8.3 (0.327) 1. the cavity def ned by a 0 , b 0 and t shall surround the component with suff cient clearance that: a) the component does not protrude beyond either surface of the carrier tape. b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. c) rotation of the component is limited to 20 maximum (see figure 3). d) lateral movement of the component is restricted to 0.5 mm maximum (see figure 4). e) see addendum in eia standard 481 for standards relating to more precise taping requirements. 2. the tape with or without components shall pass around r without damage (see figure 6). surface mount multilayer ceramic chip capacitors (smd mlccs) high temperature 175oc, x7r dielectric, 16 C 200 vdc (industrial grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c1075_x7r_ht_smd ? 3/30/2015 18 packaging information performance notes 1. cover tape break force: 1.0 kg minimum. 2. cover tape peel strength: the total peel strength of the cover tape from the carrier tape shall be: tape width peel strength 8 mm 0.1 to 1.0 newton (10 to 100 gf) 12 and 16 mm 0.1 to 1.3 newton (10 to 130 gf) the direction of the pull shall be opposite the direction of the carrier tape travel. the pull angle of the carrier tape shall be 165 to 180 from the plane of the carrier tape. during peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 10 mm/minute. 3. labeling: bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. refer to eia standards 556 and 624 . figure 3 C maximum component rotation a o b o t s maxi m u m c ompone n t r o t a tio n t op v i e w m a x i mum c o mponent r o t a t ion s ide v i e w t a p e m axi m u m width (mm) r otati o n ( t ) 8,12 2 0 16 ? 200 1 0 t a p e m a x i m u m widt h ( mm) r o tati o n ( s ) 8,12 20 16 ? 56 1 0 72 ? 200 5 t y p ic a l p o c k e t cente r line t y p i c a l c o m pon e n t c e n t e r l i n e figure 4 C maximum lateral movement 0 . 5 m m m a x i mum 0 . 5 m m m a x i mum 8 m m & 1 2 m m tape 1 . 0 m m m a x i mum 1 . 0 m m m a x i mum 1 6 m m t a p e figure 5 C bending radius r r b end i n g r a d i u s e mbo ssed c a r r i e r p unc hed c a rrier surface mount multilayer ceramic chip capacitors (smd mlccs) high temperature 175oc, x7r dielectric, 16 C 200 vdc (industrial grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c1075_x7r_ht_smd ? 3/30/2015 19 figure 6 C reel dimensions a d (see n o te ) full r a d i us, see n o t e b ( s ee note) access h o le at s l o t loc a ti on (? 40 m m mi nimum) i f p r es en t, tape slot i n core for t ape start: 2.5 mm minimum wi dt h x 10.0 mm mi n imum dep th w 3 (incl u des flan g e dis to r tion at out e r e dge) w 2 ( m eas u re d a t hub ) w 1 ( m eas u re d a t hub ) c (arbor hol e di a m e ter ) note: driv e spok es o ptiona l ; if u s ed, d i mensi o ns b an d d shall a pply. n table 8 ? reel dimensions metric will govern constant dimensions millimeters (inches) tape size a b minimum c d minimum 8 mm 178 0.20 (7.008 0.008) or 330 0.20 (13.000 0.008) 1.5 (0.05) 13.0 +0.5-0.2 (0.521 +0.02-0.008) 20.2 (0.75) 12 mm 16 mm variable dimensions millimeters (inches) tape size n minimum w 1 w 2 maximum w 3 8 mm 50 (1.6) 8. +1.5-0.0 (0.331 +0.05-0.0) 1. (0.567) shall accommodate tape width without interference 12 mm 12. +2.0-0.0 (0.88 +0.078-0.0) 18. (0.72) 16 mm 16. +2.0-0.0 (0.66 +0.078-0.0) 22. (0.882) surface mount multilayer ceramic chip capacitors (smd mlccs) high temperature 175oc, x7r dielectric, 16 C 200 vdc (industrial grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c1075_x7r_ht_smd ? 3/30/2015 20 figure 7 C tape leader & trailer dimensions t r a i le r 160 mm min imum c a r r i e r t ape e n d s t a r t r o und s p rocke t h o l e s e l ongated s p r o cke t h o l e s ( 32 mm tape and w i der ) t op c o ver t ape top c over t ape p unched c a r r i e r 8 mm & 12 m m o n l y e mboss ed c a r r i e r c o m p o n e n t s 1 0 0 m m m i n imum leader 4 0 0 mm m i n i m u m figure 8 C maximum camber c a r r i e r t a p e r o u n d s p r o c k e t h ol e s 1 m m max i m u m , e i t h e r d i r e c t i o n s t r ai gh t edge 2 5 0 m m e l o n g a t ed s p r oc k e t h ol e s ( 32 m m & w ide r t a pes ) surface mount multilayer ceramic chip capacitors (smd mlccs) high temperature 175oc, x7r dielectric, 16 C 200 vdc (industrial grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c1075_x7r_ht_smd ? 3/30/2015 21 kemet corporation world headquarters 2835 kemet way simpsonville, sc 29681 mailing address: p.o. box 5928 greenville, sc 29606 www.kemet.com tel: 864-963-6300 fax: 864-963-6521 corporate off ces fort lauderdale, fl tel: 954-766-2800 north america southeast lake mary, fl tel: 407-855-8886 northeast wilmington, ma tel: 978-658-1663 central novi, mi tel: 248-306-9353 west milpitas, ca tel: 408-433-9950 mexico guadalajara, jalisco tel: 52-33-3123-2141 europe southern europe sasso marconi, italy tel: 39-051-939111 skopje, macedonia tel: 389-2-55-14-623 central europe landsberg, germany tel: 49-8191-3350800 kamen, germany tel: 49-2307-438110 northern europe harlow, united kingdom tel: 44-1279-460122 espoo, finland tel: 358-9-5406-5000 asia northeast asia hong kong tel: 852-2305-1168 shenzhen, china tel: 86-755-2518-1306 beijing, china tel: 86-10-5877-1075 shanghai, china tel: 86-21-6447-0707 seoul, south korea tel: 82-2-6294-0550 taipei, taiwan tel: 886-2-27528585 southeast asia singapore tel: 65-6701-8033 penang, malaysia tel: 60-4-6430200 bangalore, india tel: 91-806-53-76817 note: kemet reserves the right to modify minor details of internal and external construction at any time in the interest of product improvement. kemet does not assume any responsibility for infringement that might result from the use of kemet capacitors in potential circuit designs. kemet is a registered trademark of kemet electronics corporation. surface mount multilayer ceramic chip capacitors (smd mlccs) high temperature 175oc, x7r dielectric, 16 C 200 vdc (industrial grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c1075_x7r_ht_smd ? 3/30/2015 22 disclaimer all product specif cations, statements, information and data (collectively, the information) in this datasheet are subject to change. the customer is responsible for checking and verifying the extent to which the information contained in this publication is applicable to an order at the time the order is placed. all information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied. statements of suitability for certain applications are based on kemet electronics corporations (kemet) knowledge of typical operating conditions for such applications, but are not intended to constitute C and kemet specif cally disclaims C any warranty concerning suitability for a specif c customer application or use. the information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. any technical advice inferred from this information or otherwise provided by kemet with reference to the use of kemets products is given gratis, and kemet assumes no obligation or liability for the advice given or results obtained. although kemet designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur. accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage. although all productCrelated warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other measures may not be required. surface mount multilayer ceramic chip capacitors (smd mlccs) high temperature 175oc, x7r dielectric, 16 C 200 vdc (industrial grade)

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